From a Slice of Crystal to an IC Wafer. Building an integrated circuit requires a series of manufacturing steps that introduce precise quantities of chemicals onto selected areas of the …

After testing, the ink dots identify failed chips that will be discarded after scribing.

IC wafer. Catalog Number 102682084. Type Physical object. Description Object consists of a single IC wafer. Identifying Numbers. Other number: 6F03138-22-1: Dimensions overall: 1/8 in …

IC wafer. Catalog Number 102682086. Type Physical object. Description Object consists of a single IC wafer in a support ring. Identifying Numbers. Other number: 3800179D: Barcode on …

Exhibition Digital Logic From a Slice of Crystal to an IC Wafer. Wafer Scribing Machine. Appears In: From a Slice of Crystal to an IC Wafer. Prev. Next. Details; Description; Date Introduced …

Object consists of a single IC wafer which is severely damaged. Dimensions overall: 1/8 in x 8 in x 8 in Category Component/Semiconductor/IC Credit Gift of Patrick Edsall Lot Number …

In the 1960s, operators could wear street clothes in fabrication areas because the dimensions of transistors and interconnects on an IC were much larger than typical dust particles.

Wafers are placed in a high-temperature furnace to diffuse chemical dopants into the silicon in selective areas defined by “windows” etched through the oxide. The windows are defined by …

This processed wafer is finished and ready for testing.

ICs in the 1960s typically had only 6 to 16 leads. With the aid of high quality microscopes, skilled operators were able to manipulate ultrasonic welders and attach tiny wires to contact pads and …