Compact high heat dissipation design sets a new standard for OBCs ROHM's new 4-in-1 and 6-in-1 SiC Molded Modules in the ...

An article recently made available on Engineering delves into silicon carbide (SiC)-based pressure sensors. A comprehensive review paper titled ...

Mitsubishi Electric Corporation will begin shipping samples of two new SLIMDIP series power semiconductor modules for room ...

These issues can be mitigated by using passive or active fillers. This study proposed applying Al/SiC coatings on SS substrates by spraying suspensions of Al/SiC cermet powders and xylene in PCS.

ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...

Both modules, the first SiC versions in the company’s SLIMDIP series of compact ... but all offered in the same package to help reduce the burden of designing inverter substrates.

SLIMDIP series’ first SiC modules offer high output and low ... same package to help reduce the burden of designing inverter substrates.